5533268-5 is a high-density board-to-board connector from TE Connectivity's AMP-HDI series, designed for reliable electrical and mechanical performance in rugged applications. The AMP-HDI connector family features Twin Beam Contacts (TBC) with gold plated square posts providing four areas of contact per connection. The connectors are rated for a current of 3A maximum with contact resistance of 15 mO and operate over a temperature range of -65°C to 125°C. The housing is constructed from glass-filled thermoplastic rated UL94 V-0, and the connectors are compatible with vapor phase and infrared reflow soldering. Common applications include aerospace data processing, military electronics, industrial instrumentation, and data communication systems.