6-103639-5 is a wire-to-board receptacle assembly from the AMPMODU MTE interconnection system, designed for reliable signal and power connections. This component features a 0.100 inch (2.54 mm) centerline spacing and is compatible with wire sizes ranging from 22-30 AWG (0.05-0.3 mm²). The system offers multiple contact plating options including gold (0.000015 to 0.000050 inch) and tin for various application requirements. These receptacle assemblies are commonly used in wire-to-board interconnection applications where secure, repeatable connections are required in electronic equipment and instrumentation.