643645-3 is a 13-position single inline package (SIP) socket featuring a retention solder tail configuration and dual leaf (DL) contact design. This socket is designed for reliable IC mounting with dimensions of 3055 mils in length and 2754 mils in height, providing secure component retention during assembly and operation. The socket utilizes phosphor bronze contacts with gold plating to ensure excellent electrical conductivity and corrosion resistance. With a package quantity of 60 units per tray and 4 trays per box (560 total units per box), this socket is suitable for high-volume production environments requiring consistent performance and durability in electronic assemblies.