The 87456-1 is a single-row receptacle housing assembly from the AMPMODU Mod IV interconnection system designed for wire-to-board applications with 0.100 inch (2.54 mm) centerline spacing and end-to-end stackable configuration. The housing features a dual cantilever contact beam with built-in anti-overstress capability for reliable matings, accommodates 0.025 inch (0.64 mm) square or round post contacts, and is constructed from glass-filled thermoplastic material rated 94V-0. The receptacle assembly terminates 32-20 AWG (0.03-0.6 mm²) discrete wire with insulation support and offers a choice of three contact mating pressures with multiple gold and tin plating options. This product is ideal for applications requiring compact, stackable interconnections in electronic assemblies where reliable wire-to-board connections and space efficiency are critical.