The 966140-6 is an unsealed 2.8 housing designed as a vertical PCB board header for the AMP MCP interconnection system. This 21-position header is constructed from PA 66 GF13 material with a black housing color, providing robust mechanical support for circuit board connections. The header features CuSn4 tin-plated contacts (silver-plated on request) and accommodates wire sizes up to 2.5 mm² FLR M. This component is commonly used in electronic interconnection applications where reliable, high-density board-to-board or board-to-wire connections are required, offering a cost-effective solution for standard industrial and commercial equipment designs.