The 524-AG11D is a 24-position DIP socket designed for vertical through-hole mounting on printed circuit boards. It features a closed frame design with straight legs and is constructed from thermoplastic polyester housing with beryllium copper contacts plated with gold for reliable mating. The socket has a row-to-row spacing of 15.24 mm, a centerline of 2.54 mm, and a height above the PCB of 3.43 mm, with solder tail contacts plated in tin and a post length of 3.18 mm. It operates over a temperature range of -55°C to +105°C and meets RoHS/ELV compliance standards, supporting wave solder processes up to 265°C. This socket is ideal for applications requiring secure DIP package retention in industrial, consumer, and telecommunications equipment.