642-25AB
WakefieldHeat Sink Passive BGA Pin Array Adhesive Aluminum Black Anodized .. Ver descripción completa
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Proveedor:
Wakefield
Nº de pieza:
642-25AB
RoHS:
Yes
HTS:
7616995090
COO:
CN
ECCN:
EAR99
Paquete estándar del proveedor
800
Device Cooled:
BGA
Attachment Method:
Adhesive
Dimension:
35 x 35 x 6.4 mm
Thermal Resistance:
N/A
Finish:
Black Anodized
The WAKEFIELD part 642-25AB is a high-quality heat sink designed for optimal cooling performance. With its passive BGA pin array design, it efficiently dissipates heat from electronic components, ensuring their longevity and reliability. The heat sink is made from adhesive aluminum with a sleek black anodized finish, providing excellent thermal conductivity and a visually appealing aesthetic. Ideal for a wide range of applications, this heat sink is a reliable choice for keeping your electronic systems running cool and efficient.
Palabras clave de búsqueda:
64225AB
Posibles opciones de reemplazo disponibles. Ver Alternativas
EN STOCK:
29
Puede enviar inmediatamente
Cantidad mínima de pedido:
10
Plazo de entrega de fábrica
16 Semanas
Precio (USD)
Cantidad
Precio por unidad
Precio Ext.
10
$2.67
$26.70
50
$2.43
$121.50
250
$2.33
$582.50
800
$2.24
$1,792.00
1.600
$2.21
$3,536.00
3.200
$2.18
$6,976.00
5.600
+
$2.17
$12,152.00
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