The 103670-4 is an MTE Crimp Pin Housing designed for the AMPMODU MTE interconnect system, which serves wire-to-board and wire-to-wire applications across industrial equipment including computers, medical instruments, automotive controls, and telecommunications systems. This housing accommodates 5-position crimp snap-in pin contacts and supports the flexible AWG range of #20–#32 for crimp configurations. The product is available with three plating options (15 µ" Au, 30 µ" Au, and Matte Tin) and operates reliably over a temperature range of -65°C to +105°C. The housing features latching and polarization capabilities, with swage options on posts providing retention in printed circuit boards. This component is ideal for applications requiring cost-effective, medium-volume assembly with flexibility in wire gauge selection.