104549-9 is an 80-position fine pitch SMT stacking connector designed for parallel board-to-board applications with 0.050 inch (1.27 mm) center spacing. The connector features a double-row vertical configuration with a housing constructed from glass-filled black thermoplastic rated 54V-0, and phosphor bronze contacts plated with 0.0076 mm gold in the mating area and 0.0038 mm tin-lead on the solder tail, with complete nickel underplating of 0.0127 mm. Key dimensions include an overall length (A) of 2.130 inches (54.10 mm), width (B) of 1.950 inches (49.53 mm), and spacing dimensions (C and D) of 0.900 inches (22.86 mm). This connector is ideal for high-density interconnect applications in computing, telecommunications, and industrial equipment where reliable board-to-board connections are required in space-constrained environments.