The 1-103908-5 is a swaged tall vertical through-hole IDC header with 30 µ" gold plating, part of the TE Connectivity AMPMODU MTE interconnect system. This header is designed for wire-to-board and wire-to-wire applications in industrial equipment including computers, copiers, commercial printers, appliances, medical equipment, and automotive controls. The product supports 2–25 positions per row with a 100 mil centerline spacing, accommodates #22–#30 AWG wire sizes, and features polarization and latching capabilities. It operates at 3 amps per single contact in free air with a maximum operating voltage of 267 V and temperature range of -65°C to +105°C. The swage option on posts provides enhanced retention in printed circuit boards, making it ideal for medium-volume applications requiring reliable, flexible interconnection solutions.