2288172-2 is a zSFP+ stacked pluggable I/O interconnect designed for high-speed data transmission in 2x12 configurations with inner light pipe options. This connector supports data rates up to 28 Gbps NRZ and 56 Gbps PAM-4, compliant with SFP-8402 and Fibre Channel 32G (28.05 Gbps line rate) standards. The interconnect features a high-temperature thermoplastic housing (glass-filled, UL 94V-0 black) with high-performance copper alloy contacts, nickel underplating, and gold plating on the mating area, operating reliably across -40°C to +85°C. With a minimum durability rating of 250 insertion cycles and EMI gasket suppression, this connector is ideal for data center, telecommunications, and high-speed networking applications requiring backward compatibility with existing SFP+ infrastructure while enabling progressive upgrades to higher performance standards.