2307706-5 is a horizontal through-hole/reflow (TH/THR) board-to-board receptacle from TE Connectivity's AMPMODU 2mm product line, featuring a 2.1mm solder tail length and 0.38µm (15µ") gold plating on phosphor bronze dual-beam contacts. The receptacle utilizes a high-temperature liquid crystal polymer (LCP) housing rated UL 94V0 and operates reliably across -40°C to 125°C with a maximum current rating of 2A and dielectric withstanding voltage of 650VAC. The dual-beam contact design provides increased contact surface area for reliable signal transfer, and the product is capable of reflow soldering to 260°C, supporting both automated surface-mount and traditional through-hole assembly processes. This receptacle is ideal for board-to-board stacking applications in industrial and commercial electronics requiring robust interconnection with minimal vibration-induced discontinuity.