3-87456-9 is a double-row plain housing designed for the AMPMODU Mod IV wire-to-board interconnection system. This unstamped housing features 50 positions with .100 x .100 inch [2.54 x 2.54 mm] centerline spacing and is manufactured from glass-filled thermoplastic rated 94V-0. The housing accepts receptacle contacts that terminate 32-20 AWG discrete wire and mates with .025 inch square or round posts. With a contact current rating of 3 amperes and dual cantilever contact beam design with anti-overstress feature, this housing is suitable for reliable wire-to-board connections in various electronic applications.