5050871-5 is a miniature spring socket assembly designed for discrete component connections and test applications. The socket features a closed bottom sleeve style with a socket length of 7.32 mm and accommodates mating pin diameters ranging from 1.07 to 1.24 mm. The contact assembly utilizes beryllium copper spring material with gold plating (30 µm) on the contact spring and tin plating on the copper sleeve, ensuring reliable electrical performance and corrosion resistance. The socket is RoHS and ELV compliant, supports hand and semi-automatic insertion methods, and is compatible with multiple solder processes including wave solder (240°C to 265°C) and reflow solder (245°C to 260°C). This socket is ideal for production applications requiring precision interconnections in test fixtures, instrumentation, and electronic assemblies.