5-103169-3 is a double row vertical header from the AMPMODU .025 [0.64] Square Interconnection System, designed for board-to-board connections. This 10-position header features a .100 inch [2.54 mm] centerline spacing with dimensions of A: .780 inch [19.81 mm], B: .700 inch [17.78 mm], C: .400 inch [10.16 mm], and D: .290 inch [7.37 mm]. The header has a contact diameter of .035±.003 inch [0.89±0.08 mm] and a contact area of .200 inch [5.08 mm]. It is designed for use with PC boards of minimum .055 inch [1.40 mm] thickness and is RoHS compliant. This header is commonly used in electronic interconnection applications requiring reliable board-to-board signal transmission.