5767017-3 is a fine pitch SMT stacking connector designed for parallel board-to-board applications with 114 positions. The connector features dimensions of 50.80 mm (2.000 inches) in length (A), 48.21 mm (1.898 inches) in width (B), and 36.83 mm (1.450 inches) in height (C), with a stacking height parameter (D) of 2 and a pitch dimension (E) of 25.40 mm (1.000 inches). The connector is available with tin (Sn) solder tail plating and offers contact options in both gold and palladium-nickel (PdNi) finishes, accommodating various environmental and performance requirements. This connector is commonly used in high-density interconnect applications where space constraints and reliable signal transmission are critical, such as in telecommunications equipment, data center infrastructure, and advanced computing systems.