514-AG10D is a DIPLOMATE series DIP socket assembly designed for reliable integrated circuit mounting on printed circuit boards. This 14-position, 2-row socket features screw machine contacts made from beryllium copper with gold plating on the mating area (25 µin thickness), providing excellent electrical performance with a contact resistance of 10 mO and insulation resistance of 5000 MO. The socket has a row-to-row spacing of 7.62 mm and a centerline of 2.54 mm, with a termination post length of 3.18 mm for through-hole mounting. It supports a contact current rating of 3 A and operates over a temperature range of -55°C to +125°C. The closed frame style with polarization alignment makes it ideal for applications requiring secure IC insertion and reliable electrical connections in industrial and commercial electronics.