The 530613B00000G is a Channel 5306 series board level heat sink engineered to cool TO-220 and TO-220-single gauge devices. Constructed from aluminum with a black anodize finish, this heat sink features a width of 25.40 mm, a height of 29.97 mm (1.18 inches), and a length of 12.70 mm, with dual mounting holes (ø 3.81 mm through) at the base for secure attachment. The device supports both horizontal and vertical mounting orientations and requires a mounting kit for proper installation. This heat sink is ideal for applications requiring efficient thermal management of power semiconductors in compact board-level designs, offering reliable heat dissipation across a range of operating conditions.