530614B00000G
Boyd Laconia LLCThe 530614B00000G is an aluminum, channel-style board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor devices. .. Ver descripción completa
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Proveedor:
Boyd Laconia LLC
Nº de pieza:
530614B00000G
Alias/alias:
001725
RoHS:
Yes
HTS:
8473309000
COO:
CN
ECCN:
EAR99
Paquete estándar del proveedor
2000
Tipo de paquete:
Bulk
Device Cooled:
TO-220
Attachment Method:
Screw
Dimension:
25.4 x 29.97 x 12.7 mm
Thermal Resistance:
16.7 °C/W
Finish:
Black Anodized
The 530614B00000G is a board-level channel heat sink intended for the thermal management of TO-220 and TO-220-single gauge packaged devices. Constructed from aluminum with a black anodize finish, this heat sink has a height of 29.97 mm, a width of 25.40 mm, and a length of 12.70 mm. It can be mounted either horizontally or vertically, offering design flexibility. Based on performance data, it provides a thermal resistance of approximately 10 °C/Watt under natural convection. This RoHS compliant component is ideal for applications requiring efficient heat dissipation from power transistors and voltage regulators in a compact footprint.
Palabras clave de búsqueda:
530614B00000G
EN STOCK:
3.526
Puede enviar inmediatamente
Cantidad mínima de pedido:
10
Plazo de entrega de fábrica
6 Semanas
Precio (USD)
Cantidad
Precio por unidad
Precio Ext.
10
$2.93
$29.30
50
$2.61
$130.50
250
$2.40
$600.00
500
$2.31
$1,155.00
2.000
$2.15
$4,300.00
4.000
+
$2.14
$8,560.00
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