530614B00000G
Boyd Laconia LLCThe 530614B00000G is an aluminum, channel-style board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor devices. .. Ver descripción completa
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Productos Encontrados: 0
Proveedor:
Boyd Laconia LLC
Nº de pieza:
530614B00000G
Alias/también conocido como:
001725
RoHS:
Yes
HTS:
8473309000
COO:
CN
ECCN:
EAR99
Empaque estándar del proveedor
2000
Tipo de encapsulado:
Bulk
Dispositivo Refrigerado:
TO-220
Método de Fijación:
Screw
Dimensión:
25.4 x 29.97 x 12.7 mm
Resistencia Térmica:
16.7 °C/W
Acabado:
Black Anodized
The 530614B00000G is a board-level channel heat sink intended for the thermal management of TO-220 and TO-220-single gauge packaged devices. Constructed from aluminum with a black anodize finish, this heat sink has a height of 29.97 mm, a width of 25.40 mm, and a length of 12.70 mm. It can be mounted either horizontally or vertically, offering design flexibility. Based on performance data, it provides a thermal resistance of approximately 10 °C/Watt under natural convection. This RoHS compliant component is ideal for applications requiring efficient heat dissipation from power transistors and voltage regulators in a compact footprint.
Palabras clave de búsqueda:
530614B00000G
EN STOCK:
2.526
Envío today, Introduzca el valor de la configuración.
Cantidad mínima de pedido:
10
Plazo de entrega de fábrica
6 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
10
$2.469
$24.690
50
$1.400
$70.000
250
$1.271
$317.750
500
$1.195
$597.500
2.000
$0.785
$1,570.000
4.000
+
$0.783
$3,132.000
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