530614B00000G
Boyd Laconia LLCThe 530614B00000G is an aluminum, channel-style board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor devices. .. Ver descripción completa
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Proveedor:
Boyd Laconia LLC
Nº de pieza:
530614B00000G
Alias/también conocido como:
001725
RoHS:
Yes
HTS:
8473309000
COO:
CN
ECCN:
EAR99
Embalaje estándar del proveedor
2000
Tipo de encapsulado:
Bulk
Dispositivo Refrigerado:
TO-220
Método de Fijación:
Screw
Dimensión:
25.4 x 29.97 x 12.7 mm
Resistencia Térmica:
16.7 °C/W
Acabado:
Black Anodized
The 530614B00000G is a board-level channel heat sink intended for the thermal management of TO-220 and TO-220-single gauge packaged devices. Constructed from aluminum with a black anodize finish, this heat sink has a height of 29.97 mm, a width of 25.40 mm, and a length of 12.70 mm. It can be mounted either horizontally or vertically, offering design flexibility. Based on performance data, it provides a thermal resistance of approximately 10 °C/Watt under natural convection. This RoHS compliant component is ideal for applications requiring efficient heat dissipation from power transistors and voltage regulators in a compact footprint.
Palabras clave de búsqueda:
530614B00000G
EN STOCK:
2.026
Puede enviar inmediatamente
Cantidad mínima de pedido:
10
Plazo de entrega de fábrica
6 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
10
$3.03
$30.30
50
$2.68
$134.00
250
$2.43
$607.50
500
$2.32
$1,160.00
2.000
$2.19
$4,380.00
4.000
+
$2.18
$8,720.00
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