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MCP6022T-E/ST by microchip technology
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FICHA TÉCNICA

MCP6022T-E/ST

Microchip Technology

Op Amp Dual GP R-R I/O 5.5V Automotive 8-Pin TSSOP T/R .. Ver descripción completa

Cumple con RoHS
REEL embalaje
Accesorios
Accesorios
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Proveedor:
Microchip Technology
Nº de pieza:
MCP6022T-E/ST
RoHS:
Yes
HTS:
8542330001
COO:
TH
ECCN:
EAR99
Paquete estándar del proveedor Esta información se proporciona a los clientes que prefieren comprar en múltiplos de la cantidad del paquete estándar del fabricante. Las cantidades mínimas de pedido y los múltiplos de pedido requeridos se presentan con nuestra información de precios y d
2500
Tipo de paquete:
REEL
Maximum Operating Supply Voltage:
5.5 V
Dimension:
3 x 4.4 x 0.9 mm
Maximum Input Bias Current:
0.005@5.5V@125C uA
Family:
MCP6022
Maximum Input Offset Current:
0.000001(Typ)@5.5V uA
Maximum Input Offset Voltage:
0.25@5V mV
Maximum Dual Supply Voltage:
N/R
Manufacturer Type:
General Purpose Amplifier
The MCP6022T-E/ST is a dual general-purpose operational amplifier specifically designed for automotive applications. With its rail-to-rail input/output capability, it can operate on a wide voltage range of up to 5.5V. This op amp is housed in an 8-pin TSSOP package, making it compact and easy to integrate into automotive circuitry. It offers high precision and low noise, making it ideal for applications requiring accurate signal conditioning. Whether used in engine control, powertrain, or safety systems, the MCP6022T-E/ST ensures reliable and high-performance operation in automotive environments. Sold in tape and reel packaging, it is convenient for automated assembly processes.
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MCP6022TEST
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EN STOCK: 270
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Cantidad mínima de pedido:
250
Plazo de entrega de fábrica
5 Semanas
Precio (USD)
Cantidad
Precio por unidad
Precio Ext.
250
$1.11
$277.50
500
$1.10
$550.00
1.000
$1.08
$1,080.00
2.500
$1.06
$2,650.00
5.000
$1.05
$5,250.00
7.500
$1.04
$7,800.00
10.000
$1.03
$10,300.00
15.000 +
$1.02
$15,300.00
Suppliers Standard Package
Guías de productos
PDF FICHA TÉCNICA
Product Changes
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 22-Jan-2004 - Product Change Notice
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 12-Apr-2012 - Microchip is announcing the qualification of MMT (ALPH) assembly site for the listed 8L TSSOP packag
PDF PCN - 20-Jun-2012 - Qualification Of 8L Tssop Package At Mmt (Alph) Assembly Site
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 25-Oct-2004 - Change From Snpb Plating To Matte Tin Plating (Industry-Standard Pure Sn) Of The Device Leads
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 03-Jun-2004 - QUALIFY UNISEM MALAYSIA FOR ASSEMBLY OF 8L TSSOP PACKAGE FOR PB-FREE RELEASE
PDF PCN - 01-Feb-2006 - Product Change Notice
PDF PCN - 19-Mar-2007 - Product Change Notice
PDF PCN - 01-Sep-2004 - ADD MICROCHIP THAILAND AS A QUALIFIED PROBE MANUFACTURING SITE
PDF PCN - 27-Sep-2004 - All standard Microchip devices in the listed packages will change from SnPbplating (standard tin-lea
PDF PCN - 13-Jul-2006 - Product Change Notice
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 17-Sep-2006 - QUALIFICATION OF 8L TSSOP AT VGT
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 31-May-2007 - Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)
PDF PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 05-Oct-2007 - Qualification of G700 mold compound in TSSOP packages at ATP!
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 01-Mar-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f
PDF PCN - 01-Jun-2012 - Qualification Of 8L Tssop Package At Mmt (Alph) Assembly Site
PDF PCN - 03-Jun-2004 - Product Change Notice

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