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MCP6024T-I/SL by microchip technology
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FICHA TÉCNICA

MCP6024T-I/SL

Microchip Technology

Op Amp Quad GP R-R I/O 5.5V Automotive 14-Pin SOIC N T/R .. Ver descripción completa

Cumple con RoHS
REEL embalaje
Accesorios
Accesorios
This product is backed by Ecco Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee
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Proveedor:
Microchip Technology
Nº de pieza:
MCP6024T-I/SL
RoHS:
Yes
HTS:
8542330001
COO:
TH
ECCN:
EAR99
Paquete estándar del proveedor Esta información se proporciona a los clientes que prefieren comprar en múltiplos de la cantidad del paquete estándar del fabricante. Las cantidades mínimas de pedido y los múltiplos de pedido requeridos se presentan con nuestra información de precios y d
2600
Tipo de paquete:
REEL
Dimension:
8.65 x 3.9 x 1.25(Min) mm
Family:
MCP6024
Maximum Input Offset Current:
0.000001(Typ)@5.5V uA
Maximum Input Offset Voltage:
0.5@5.5V mV
Maximum Input Bias Current:
0.015@5.5V@85C uA
Maximum Operating Supply Voltage:
5.5 V
Manufacturer Type:
General Purpose Amplifier
Maximum Dual Supply Voltage:
N/R
The MCP6024T-I/SL is a high-performance, low-power quad operational amplifier with rail-to-rail input and output capability. This versatile op amp operates on a wide voltage range of 5.5V, making it ideal for automotive applications. The 14-pin SOIC package and tape/reel packaging provide convenient and reliable integration into your design. Trust the MCP6024T-I/SL for precision amplification in your automotive electronics projects.
Palabras clave de búsqueda:
MCP6024TISL
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EN STOCK: 1.350
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Cantidad mínima de pedido:
250
Plazo de entrega de fábrica
6 Semanas
Precio (USD)
Cantidad
Precio por unidad
Precio Ext.
250
$1.59
$397.50
500
$1.58
$790.00
1.000
$1.54
$1,540.00
2.600
$1.53
$3,978.00
5.200
$1.52
$7,904.00
7.800
$1.51
$11,778.00
10.400
$1.50
$15,600.00
15.600 +
$1.49
$23,244.00
Suppliers Standard Package
Guías de productos
PDF FICHA TÉCNICA
Product Changes
PDF PCN - 01-Jun-2006 - Package Qualification For 14L Pdip .300'' At Unis
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 19-Apr-2010 - Microchip is announcing the Qualification of the 14L & 16L SOIC (.150) at GTK (GRTK) assembly site i
PDF PCN - 17-Sep-2006 - QUALIFICATION OF 8L TSSOP AT VGT
PDF PCN - 30-Apr-2007 - Qualification Of 14L Pdip With Ge-800 ''Green'' Mold Compound At Vgt Assembly
PDF PCN - 22-Jan-2004 - Product Change Notice
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 31-Jul-2007 - Qualification Of 14L Tssop Package Assembly At Vgt (Vigilant, Thailand)
PDF PCN - 15-Oct-2010 - Microchip is announcing the Qualification of the 14L & 16L SOIC (.150) at GTK (GRTK) assembly site i
PDF PCN - 01-Sep-2004 - ADD MICROCHIP THAILAND AS A QUALIFIED PROBE MANUFACTURING SITE
PDF PCN - 24-Nov-2004 - Product Change Notice
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 01-Mar-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM
PDF PCN - 30-Jul-2010 - QUALIFICATION OF THE 14L & 16L SOIC (.150) AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 17-Sep-2006 - QUALIFICATION OF 14L TSSOP AT ATP
PDF PCN - 05-May-2004 - Qualify 14L Soic .150'' Package Assembly At Unisem Thailand
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 01-Apr-2006 - Qualificaton Of 14L Pdip At New Assembly Site: Aic
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 31-Mar-2007 - QUALIFICATION OF 14L TSSOP DIE ATTACH EPOXY AND STAMPED LEADFRAME AT UNIS
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 04-Apr-2008 - Cancelled Qualification Of 14L Pdip At New Assembly Site: Aic
PDF PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 24-Nov-2004 - To Qualify 14L Soic For Assembly At Microchip Thailand
PDF PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse

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