MCP6024T-I/SL by microchip technology
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FICHA TÉCNICA

MCP6024T-I/SL

Microchip Technology

Op Amp Quad GP R-R I/O 5.5V Automotive 14-Pin SOIC N T/R .. Ver descripción completa

Cumple con RoHS
REEL embalaje
Accesorios
Accesorios
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Proveedor:
Microchip Technology
Nº de pieza:
MCP6024T-I/SL
RoHS:
Yes
HTS:
8542330001
COO:
TH
ECCN:
EAR99
Embalaje estándar del proveedor La cantidad de artículos, la longitud, el peso o el volumen contenidos en el embalaje original del proveedor para facilitar un almacenamiento, una manipulación y una distribución eficientes.
2600
Tipo de encapsulado:
REEL
Dimensión:
8.65 x 3.9 x 1.25(Min) mm
The MCP6024T-I/SL is a high-performance, low-power quad operational amplifier with rail-to-rail input and output capability. This versatile op amp operates on a wide voltage range of 5.5V, making it ideal for automotive applications. The 14-pin SOIC package and tape/reel packaging provide convenient and reliable integration into your design. Trust the MCP6024T-I/SL for precision amplification in your automotive electronics projects.
Palabras clave de búsqueda:
MCP6024TISL
  Diferentes opciones de embalaje disponibles.  Ver Alternativas
EN STOCK: 1.765
Envío today, Introduzca el valor de la configuración.
Cantidad mínima de pedido:
250
Plazo de entrega de fábrica
25 Semanas
Precio (USD)
Cantidad
Precio unitario
Precio total
250
$2.12
$530.00
500
$2.11
$1,055.00
1.000
$2.10
$2,100.00
2.600
$1.92
$4,992.00
5.200
$1.91
$9,932.00
7.800
$1.90
$14,820.00
10.400
$1.89
$19,656.00
15.600 +
$1.88
$29,328.00
Embalaje estándar del proveedor
Guías de productos
PDF Hoja de datos
Cambios del producto
PDF PCN - 01-Jun-2006 - Package Qualification For 14L Pdip .300'' At Unis
PDF PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list
PDF PCN - 19-Apr-2010 - Microchip is announcing the Qualification of the 14L & 16L SOIC (.150) at GTK (GRTK) assembly site i
PDF PCN - 17-Sep-2006 - QUALIFICATION OF 8L TSSOP AT VGT
PDF PCN - 30-Apr-2007 - Qualification Of 14L Pdip With Ge-800 ''Green'' Mold Compound At Vgt Assembly
PDF PCN - 22-Jan-2004 - Product Change Notice
PDF PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels
PDF PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE
PDF PCN - 31-Jul-2007 - Qualification Of 14L Tssop Package Assembly At Vgt (Vigilant, Thailand)
PDF PCN - 15-Oct-2010 - Microchip is announcing the Qualification of the 14L & 16L SOIC (.150) at GTK (GRTK) assembly site i
PDF PCN - 01-Sep-2004 - ADD MICROCHIP THAILAND AS A QUALIFIED PROBE MANUFACTURING SITE
PDF PCN - 24-Nov-2004 - Product Change Notice
PDF PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI
PDF PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die
PDF PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem
PDF PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol
PDF PCN - 11-Nov-2004 - Product Change Notice
PDF PCN - 01-Mar-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM
PDF PCN - 30-Jul-2010 - QUALIFICATION OF THE 14L & 16L SOIC (.150) AT GTK (GRTK) ASSEMBLY SITE.
PDF PCN - 17-Sep-2006 - QUALIFICATION OF 14L TSSOP AT ATP
PDF PCN - 05-May-2004 - Qualify 14L Soic .150'' Package Assembly At Unisem Thailand
PDF PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS
PDF PCN - 01-Apr-2006 - Qualificaton Of 14L Pdip At New Assembly Site: Aic
PDF PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded
PDF PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi
PDF PCN - 31-Mar-2007 - QUALIFICATION OF 14L TSSOP DIE ATTACH EPOXY AND STAMPED LEADFRAME AT UNIS
PDF PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab
PDF PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f
PDF PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ
PDF PCN - 08-Mar-2007 - Product Change Notice
PDF PCN - 04-Apr-2008 - Cancelled Qualification Of 14L Pdip At New Assembly Site: Aic
PDF PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.
PDF PCN - 24-Nov-2004 - To Qualify 14L Soic For Assembly At Microchip Thailand
PDF PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse

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